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INTEGRATED CIRCUITS
DATA SHEET
TDA8444; TDA8444T; TDA8444AT Octuple 6-bit DACs with I2C-bus
Product specification Supersedes data of March 1991 File under Integrated Circuits, IC01 1999 Apr 29
Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
FEATURES * Eight DACs with 6-bit resolution * Adjustable common output swing * Push-pull outputs * Outputs short-circuit protected * Three programmable slave address bits * Large supply voltage range * Low temperature coefficient. GENERAL DESCRIPTION The interface circuit is a bipolar IC in a DIP16, SO16, or SO20 package made in an I2L-compatible 18 V process. QUICK REFERENCE DATA SYMBOL VCC ICC P VVMAX Vo(DACn) Vo(DACn)(max) Isource(min) Isink(min) PARAMETER supply voltage supply current power dissipation input effective voltage DAC output voltage minimum DAC source current minimum DAC sink current VMAX = VCC data = 1FH data = 1FH maximum DAC output voltage 1 < VMAX < VCC - 2.0 VCC = 12 V CONDITIONS - - 1 0.1 - 2 2 MIN. 4.5
TDA8444; TDA8444T; TDA8444AT
The TDA8444 contains eight programmable 6-bit DAC outputs, an I2C-bus slave receiver with three (two for SO16) programmable address bits and one input (VMAX) to set the maximum output voltage. Each DAC can be programmed separately by a 6-bit word to 64 values, but VMAX determines the maximum output voltage for all DACs. The resolution will be approximately 164VMAX. At power-on all DACs are set to their lowest value.
TYP. 12 14 170 - - - - - -
MAX. 13.2
UNIT V mA mW V V V mA mA
VCC - 2.0 VCC - 0.5 - -
VMAX + 0.3 -
ORDERING INFORMATION TYPE NUMBER TDA8444 TDA8444T TDA8444AT PACKAGE NAME DIP16 SO16 SO20 DESCRIPTION plastic dual in-line package; 16 leads (300 mil); long body plastic small outline package; 16 leads; body width 7.5 mm plastic small outline package; 20 leads; body width 7.5 mm VERSION SOT38-1 SOT162-1 SOT163-1
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Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
BLOCK DIAGRAM
TDA8444; TDA8444T; TDA8444AT
handbook, full pagewidth
A0 5
A1 6
A2 7
VCC 1
VEE 8
SDA SCL
3 4 I2C BUS SLAVE RECEIVER REFERENCE VOLTAGE GENERATOR
TDA8444
VMAX
2
DAC0 9 DAC0
DAC1 10 DAC1
DAC2 11 DAC2
DAC3 12 DAC3
DAC4 13 DAC4
DAC5 14 DAC5
DAC6 15 DAC6
DAC7 16 DAC7
MGH513
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
PINNING PIN SYMBOL VCC VMAX SDA SCL A0 A1 A2 VEE DAC0 DAC1 DAC2 DAC3 DAC4 DAC5 DAC6 DAC7 n.c. TDA8444 (DIP16) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 - TDA8444T (SO16) 1 2 3 4 6 7 - 8 9 10 11 12 13 14 15 16 5 TDA8444AT (SO20) 1 2 3 4 7 8 9 10 11 13 14 15 16 17 18 20 5, 6, 12, 19 supply voltage
TDA8444; TDA8444T; TDA8444AT
DESCRIPTION
control input for DAC maximum output voltage I2C-bus serial data input/output I2C-bus serial clock programmable address bit 0 for I2C-bus slave receiver programmable address bit 1 for I2C-bus slave receiver programmable address bit 2 for I2C-bus slave receiver ground analog voltage output 0 analog voltage output 1 analog voltage output 2 analog voltage output 3 analog voltage output 4 analog voltage output 5 analog voltage output 6 analog voltage output 7 not connected
handbook, halfpage
VCC 1 VMAX 2 SDA 3 SCL 4
handbook, halfpage
16 DAC7 15 DAC6 14 DAC5 13 DAC4
VCC 1 VMAX 2 SDA 3 SCL 4
16 DAC7 15 DAC6 14 DAC5 13 DAC4
TDA8444
A0 5 A1 6 A2 7 VEE 8
MGH512
TDA8444T
12 DAC3 11 DAC2 10 DAC1 9 DAC0
n.c. 5 A0 6 A1 7 VEE 8
MGL531
12 DAC3 11 DAC2 10 DAC1 9 DAC0
Fig.2 Pin configuration (TDA8444; DIP16).
Fig.3 Pin configuration (TDA8444T; SO16).
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Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
TDA8444; TDA8444T; TDA8444AT
handbook, halfpage
VCC 1 VMAX 2 SDA 3 SCL 4 n.c. 5
20 DAC7 19 n.c. 18 DAC6 17 DAC5 16 DAC4
TDA8444AT
n.c. 6 A0 7 A1 8 A2 9 VEE 10
MGL532
15 DAC3 14 DAC2 13 DAC1 12 n.c. 11 DAC0
Fig.4 Pin configuration (TDA8444AT; SO20).
FUNCTIONAL DESCRIPTION I2C-bus interface The I2C-bus interface is a receive-only slave, which accepts data according the format shown in Table 1. Table 1 S Note 1. S = START condition; A2 to A0 = programmable address bits; A = Acknowledge; I3 to I0 = Instruction bits; SD to SA = subaddress bits; X = don't care; D5 to D0 = data bits; P = STOP condition. Valid addresses are: TDA8444 and TDA8444AT: 40H, 42H, 44H, 46H, 48H, 4AH, 4CH and 4EH TDA8444T: 48H, 4AH, 4CH and 4EH (A2 is always logic 1). All other addresses cannot be acknowledged by the circuit. The actual slave address depends on the programmable address bits A2, A1 and A0. This way up to eight circuits can be used on one I2C-bus. Valid instructions are: 00H to 0FH; F0H to FFH. I2C-bus format (see note 1) 0 1 0 0 A2 A1 A0 0 A I3 I2 I1 I0 SD SC SB SA A X X D5 D4 D3 D2 D1 D0 A P
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Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
The circuit will not react to other combinations of the 4 instruction bits I3 to I0 than 0 or F, but will still generate an acknowledge. The difference between instruction 0 and F is only important when more than one data byte is sent within one transmission. Instruction 0 causes the data bytes to be written into the DAC-latches with consecutive subaddresses starting with the subaddress given in the instruction byte (auto-increment of subaddress), while instruction F will cause a consecutive writing of the data bytes into the same DAC-latch whose subaddress was given in the instruction byte. In case of only one data byte the DAC-latch with the subaddress equal to the subaddress in the instruction byte will receive the data. Valid subaddresses are: 0H to 7H. The subaddresses correspond to DAC0 to DAC7. The Auto-Increment (AI) function of instruction 0, however, works on all possible subaddresses 0 to F in such a way that next to subaddress F, subaddress 0 will follow, and so on. The data will be latched into the DAC-latch on the positive-going edge of the acknowledge related clock pulse. The specification of the SCL and SDA I/O meets the I2C-bus specification. For protection against positive voltage pulses on pins 3 and 4, zener diodes are
TDA8444; TDA8444T; TDA8444AT
connected between these pins and VEE. This means that normal bus line voltage should not exceed 5.5 V. The address inputs A0, A1 and A2 can be easily programmed by either a connection to VEE (An = 0) or VCC (An = 1). If the inputs are left floating the result will be An = 1. VMAX The VMAX input gives a means of compressing the DAC output voltage swing. The maximum DAC output voltage will be equal to VMAX + VDAC(min), while the 6-bit resolution is maintained. This enables a higher voltage resolution for smaller output swings. DACs The DACs consist of a 6-bit data-latch, current switches and an opamp. The current sources connected to the switches have values with weights 20 to 25. The sum of the switched on currents is converted by the opamp into a voltage between approximately 0.5 and 10.5 V if VMAX = VCC = 12 V. The DAC outputs are short-circuit protected against VCC and VEE. Capacitive load on the DAC outputs should not exceed 2 nF in order to prevent possible oscillations at certain levels. The temperature coefficient for each of the outputs remains in all possible conditions well below 0.1 LSB per Kelvin.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC ICC P(max) Vi(n) supply voltage supply current maximum power dissipation input voltage pins SDA and SCL pins VMAX, A0 to A2 and DAC0 to DAC7 In Tstg Tamb current in all pins except VCC and VEE storage temperature operating ambient temperature PARAMETER -0.5 -10 - -0.5 -0.5 -0.5 - -65 -20 MIN. +18 +40 500 +5.9 +5.9 VCC + 0.5 10 +150 +70 MAX. V mA mW V V V mA C C UNIT
QUALITY SPECIFICATION In accordance with "SNW-FQ-611-E".
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Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) TDA8444 TDA8444T TDA8444AT Note 1. When mounted on a Printed-Circuit Board (PCB). CHARACTERISTICS VCC = 12 V; Tamb = 25 C; unless otherwise specified. SYMBOL Supply VCC ICC P Vrst Pin VMAX Vi(VMAX) Ii input effective voltage input current VMAX = VCC VMAX = 1 V Pins SDA and SCL VI VIL VIH IIL IIH PIN SDA VOL Io(sink) VI VIL VIH IIL IIH LOW-level output voltage output sink current IL = 3 mA - 3 - 8 - - - input voltage LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current VSDA = VSCL = 6 V 0 - 3.0 VSDA = VSCL = -0.3 V - - - - - - - 1 - - - - - supply voltage supply current power dissipation power reset voltage VMAX = VCC = 12 V; data = 00H 4.5 12 - 1 PARAMETER CONDITIONS MIN. note 1 note 1 PARAMETER thermal resistance from junction to ambient
TDA8444; TDA8444T; TDA8444AT
CONDITIONS in free air
VALUE 75 100 85
UNIT K/W K/W K/W
TYP.
MAX.
UNIT
12 14 170 -
13.2 19 250 4 VCC - 2.0 10 10
V mA mW V
V A A
5.5 1.0 - -10 10 0.4 -
V V V A A V mA
Address bits (A0 to A2) input voltage LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current VAn = VEE VAn = VCC 0 - 2.2 -10 - VCC 1.0 - - 1 V V V A A
-15 -
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Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
TDA8444; TDA8444T; TDA8444AT
MIN. - 0.28 TYP. MAX. VCC - 0.5 0.5 UNIT
SYMBOL
PARAMETER
CONDITIONS
DACs (DAC0 to DAC7) Vo Vo(min) Vo(max) DAC output voltage minimum output voltage maximum output voltage VMAX = VCC data = 00H; IL = -2 mA data = 3FH; IL = -2 mA VMAX = VCC 1 < VMAX < 10 V Io(sink) Io(source) Zo DNL INL GFS G/data TC Note output sink current output source current output impedance differential non-linearity integral non-linearity DC gain match at full-scale DC gain versus other DAC data change temperature coefficient VDAC = VCC; data = 1FH VDAC = VEE; data = 1FH -2 IL +2 mA; data = 1FH VMAX = VCC; IL = -2 mA VMAX = VCC; IL = -2 mA data = 3FH; IL = -2 mA data = 3FH; IL = -2 mA data = 3FH; IL = -2 mA 10.0 - 2 -2 - - - - - - 10.5 note 1 8 - 4 - - - <0.5 <0.1 11.5 - 15 -6 50 0.5 0.5 5 - - V V mA mA LSB LSB % LSB LSB/K 0.1 0.1 V V
V swing 1. The output voltage is typically: ------------------------------- x V MAX + V o ( 00H ) with Vswing = Vo(3FH) - Vo(00H) for VMAX = VCC. ( V CC - 2.0 )
1999 Apr 29
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Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
TEST AND APPLICATION INFORMATION
TDA8444; TDA8444T; TDA8444AT
handbook, halfpage
12
MGH514
handbook, halfpage
12
MGL533
VO(DAC) (V)
VMAX = 12 V
VO(DAC) (V)
VCC = 12 V
8
VMAX = 10 V
8 VCC = 8 V
VMAX = 6 V 4 4 VCC = 5 V
VMAX = 1 V 0 00 05 0A 0F 14 19 1E 23 28 2D 32 37 3C 3F data (hex) 0 00 05 0A 0F 14 19 1E 23 28 2D 32 37 3C 3F data (hex)
VCC = 12 V.
VMAX = VCC.
Fig.5
DAC output voltage as a function of programmed value.
Fig.6
DAC output voltage as a function of programmed value.
1999 Apr 29
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Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TDA8444; TDA8444T; TDA8444AT
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
ISSUE DATE 92-10-02 95-01-19
1999 Apr 29
10
Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
TDA8444; TDA8444T; TDA8444AT
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1999 Apr 29
11
Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
TDA8444; TDA8444T; TDA8444AT
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1999 Apr 29
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Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA8444; TDA8444T; TDA8444AT
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Apr 29
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Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8444; TDA8444T; TDA8444AT
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1999 Apr 29
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Philips Semiconductors
Product specification
Octuple 6-bit DACs with I2C-bus
NOTES
TDA8444; TDA8444T; TDA8444AT
1999 Apr 29
15
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545002/750/03/pp16
Date of release: 1999 Apr 29
Document order number:
9397 750 04699

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